A Synergetic Training Network on Energy beam Processing: from Modelling to Industrial Applications

A Synergetic Training Network on Energy beam Processing: from Modelling to Industrial Applications

(Drittmittelfinanzierte Gruppenförderung – Teilprojekt)

SEM image of a cross section through a dedicated test structure together with EDX maps of Ga, Si, O and C. The test structure consists of a homogeneous and thick layer of material being redeposited during FIB sputtering of silicon.
SEM image of a cross section through a dedicated test structure together with EDX maps of Ga, Si, O and C. The test structure consists of a homogeneous and thick layer of material being redeposited during FIB sputtering of silicon.

Titel des Gesamtprojektes: A Synergetic Training Network on Energy beam Processing: from Modelling to Industrial Applications
Projektleitung:
Projektbeteiligte:
Projektstart: 15. Januar 2013
Projektende: 14. Januar 2017
Akronym: STEEP
Mittelgeber: EU - 7. RP / People / Initial Training Networks (ITN)
URL: http://www.steep-itn.eu/index.aspx

Abstract

The overall aim of the STEEP Initial Training Network is to establish a transnational research and training platform for the formation and career development of young researchers on energy beam (EB) processing methods - laser, abrasive waterjet machining and focused ion beam machining - which together represent a scientific field of critical importance for further advancement of European of high value-added manufacturing industry.

 

Whilst these processes differ in nature, a set of key commonalities can be identified among them when considered as dwell-time dependent processes; this allows the approach of EB processes under a unitary technology umbrella. The key element that brings all the EB processing methods together under the STEEP umbrella is a unifying modelling platform of the footprints, as a result of energy beam - workpiece interactions, followed by the development of an original beam path simulator.

 

Stage 1: Develop a generic modelling platform to predict the full 3D profile of footprints obtained as a result of the interaction between any energy beam and geometrically complex target surfaces.

Stage 2: Develop methods to calibrate the generic footprint models for various EB processing methods; validate the modelling approach on different EB processes.

Stage 3: Develop a beam path simulator that uses the modelled footprints to convolute full 3D surfaces; testing of the beam simulator will enable corrective actions to the EB parameters for error minimisation.

Stage 4: Implement the beam path simulator on real workstations to generate micro/meso/macro freeforms using three complementary energy beam processes (waterjet, laser, ion beam).

 

Among other tasks, the work at the Chair of Electron Devices (FAUEN) focused on two specific aspects of focused ion beam (FIB) processing and modelling: Detailed analysis and characterization of redeposited material during FIB sputtering of silicon and the determination of the current density profile of the ion beam tails by dedicated scanning spreading resistance microscopy (SSRM) measurements of FIB induced damage in silicon.

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